Nanoscale tribological aspects of chemical mechanical polishing: A review

Nanoscale tribological aspects of chemical mechanical polishing: A review

The semiconductor industry is the backbone of exponentially growing digitization. Countries from the east and the west both are investing significantly to accelerate this growth. Chemical mechanical planarization (CMP) is one of the crucial technologies for expediting this growth. In 1986, IBM first...

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Bibliographic Details
Main Authors: Debottam Datta, Himanshu Rai, Swarnima Singh, Meenakshi Srivastava, Rajesh Kumar Sharma, Nitya Nand Gosvami
Format: Article
Language:English
Published: Elsevier 2022-10-01
Series:Applied Surface Science Advances
Subjects:
Chemical mechanical polishing
Nanotribology
Atomic force microscopy
Material removal rate
Wafer manufacturing
Online Access:http://www.sciencedirect.com/science/article/pii/S2666523922000769

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http://www.sciencedirect.com/science/article/pii/S2666523922000769

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