Nanoscale tribological aspects of chemical mechanical polishing: A review
The semiconductor industry is the backbone of exponentially growing digitization. Countries from the east and the west both are investing significantly to accelerate this growth. Chemical mechanical planarization (CMP) is one of the crucial technologies for expediting this growth. In 1986, IBM first...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-10-01
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| Series: | Applied Surface Science Advances |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666523922000769 |