Implementation of Chip-Level Optical Interconnect With Laser and Photodetector Using SOI-Based 3-D Guided-Wave Path

Implementation of Chip-Level Optical Interconnect With Laser and Photodetector Using SOI-Based 3-D Guided-Wave Path

A chip-level optical interconnect module combined with a vertical-cavity surface-emitting laser (VCSEL) chip, a photodetector (PD) chip, a driver integrated circuit (IC), and an amplifier IC on a silicon-on-insulator (SOI) substrate with 3-D guided-wave paths is experimentally demonstrated. Such an...

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Bibliographic Details
Main Authors: Po-Kuan Shen, Chin-Ta Chen, Chia-Hao Chang, Chien-Yu Chiu, Sheng-Long Li, Chia-Chi Chang, Mount-Learn Wu
Format: Article
Language:English
Published: IEEE 2014-01-01
Series:IEEE Photonics Journal
Online Access:https://ieeexplore.ieee.org/document/6960117/

Internet

https://ieeexplore.ieee.org/document/6960117/

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