Reduction of interface thermal resistance between TIM and metal surface by tuning wettability
Thermal management of electronics is becoming demanding with the miniaturization of integrated circuit and the shift to next-generation high-power electronics. Thermal interface material (TIM), which is typically a mixture of silicone oil and high thermal-conductivity fillers, is often used to remov...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2021-05-01
|
| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/87/898/87_21-00023/_pdf/-char/en |