Analysis of Numerical Micromodulus Coupled with Influence Function for Brittle Materials via Bond-Based Peridynamics
In this paper, the numerical micromodulus is derived for the plane stress problem to develop a new insight into the application of bond-based peridynamics. Considering the nonlocal property of peridynamics, the numerical micromodulus coupled with influence function provides a reasonable description...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-05-01
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Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/13/10/5959 |