Analysis of Numerical Micromodulus Coupled with Influence Function for Brittle Materials via Bond-Based Peridynamics

Analysis of Numerical Micromodulus Coupled with Influence Function for Brittle Materials via Bond-Based Peridynamics

In this paper, the numerical micromodulus is derived for the plane stress problem to develop a new insight into the application of bond-based peridynamics. Considering the nonlocal property of peridynamics, the numerical micromodulus coupled with influence function provides a reasonable description...

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Bibliographic Details
Main Authors: Yachen You, Siyi Jia
Format: Article
Language:English
Published: MDPI AG 2023-05-01
Series:Applied Sciences
Subjects:
peridynamics
numerical micromodulus
influence function
deformation
fracture
Online Access:https://www.mdpi.com/2076-3417/13/10/5959

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