Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven
The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature field of a printed circuit board assembly (PCBA) during the hot air convection reflow soldering process. This paper proposes a new approach that integrates the theoretical calculation, numerical simulation a...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-09-01
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| Series: | Symmetry |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-8994/15/9/1739 |