Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven

Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven

The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature field of a printed circuit board assembly (PCBA) during the hot air convection reflow soldering process. This paper proposes a new approach that integrates the theoretical calculation, numerical simulation a...

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Bibliographic Details
Main Authors:	Bubu Xie, Cai Chen, Yihao Lin, Dong Chen, Wei Huang, Kailin Pan, Yubing Gong
Format:	Article
Language:	English
Published:	MDPI AG 2023-09-01
Series:	Symmetry
Subjects:	reflow soldering nozzle-matrix gas flow velocity response surface model optimization
Online Access:	https://www.mdpi.com/2073-8994/15/9/1739

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