Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

Sn63Pb37/SAC305 mixed solder joint is inevitably in the electronic device requiring high reliability, such as health care, aerospace etc. However, the usage history of mixed solder joint is relatively short and as such their interfacial behaviour and reliability in service has not been completely fi...

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Bibliographic Details
Main Authors: Sen Cong, Weiwei Zhang, He Zhang, Peng Liu, Xingwen Tan, Lang Wu, Rong An, Yanhong Tian
Format: Article
Language:English
Published: IOP Publishing 2021-01-01
Series:Materials Research Express
Subjects:
interfacial behaviour
mixed solder joint
intermetallic compound
thermal aging test
electronic packaging
Online Access:https://doi.org/10.1088/2053-1591/ac3168

Internet

https://doi.org/10.1088/2053-1591/ac3168

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