Research on the Effects of Process Parameters on Surface Roughness in Wet-Activated Silicon Direct Bonding Base on Orthogonal Experiments

Research on the Effects of Process Parameters on Surface Roughness in Wet-Activated Silicon Direct Bonding Base on Orthogonal Experiments

Surface roughness is a very important index in silicon direct bonding and it is affected by processing parameters in the wet-activated process. These parameters include the concentration of activation solution, holding time and treatment temperature. The effects of these parameters were investigated...

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Bibliographic Details
Main Authors: Lei NIE, Huajing LI, Wenjing XIANG
Format: Article
Language:English
Published: Kaunas University of Technology 2015-11-01
Series:Medžiagotyra
Subjects:
wafer bonding, surface hydrophilicity, wet activation, process optimization
Online Access:http://matsc.ktu.lt/index.php/MatSc/article/view/9711

Internet

http://matsc.ktu.lt/index.php/MatSc/article/view/9711

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