Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera
Recently, printed circuit boards (PCBs) have become multi-layered and complex. It is to provide both multiple functions and to be compact with the development of electronic device such as smartphones. Processing by CO2 laser is frequently used as an effective method of generating blind via holes (BV...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2016-03-01
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| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/82/836/82_15-00491/_pdf/-char/en |