Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera
Recently, printed circuit boards (PCBs) have become multi-layered and complex. It is to provide both multiple functions and to be compact with the development of electronic device such as smartphones. Processing by CO2 laser is frequently used as an effective method of generating blind via holes (BV...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2016-03-01
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| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/82/836/82_15-00491/_pdf/-char/en |
| _version_ | 1797988969177153536 |
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| author | Toshiki HIROGAKI Eiichi AOYAMA Keiji OGAWA Suguru ONCHI Munetaka IOZUMI |
| author_facet | Toshiki HIROGAKI Eiichi AOYAMA Keiji OGAWA Suguru ONCHI Munetaka IOZUMI |
| author_sort | Toshiki HIROGAKI |
| collection | DOAJ |
| description | Recently, printed circuit boards (PCBs) have become multi-layered and complex. It is to provide both multiple functions and to be compact with the development of electronic device such as smartphones. Processing by CO2 laser is frequently used as an effective method of generating blind via holes (BVHs) to connect the circuit layers of multi-layer board. However, there are some kinds of laser drilling methods in this manufacturing field. Among them, Cu direct laser processing is attracted attention, which is a drilling method of both the surface Cu circuit layer and insulation substrate layer at the same time. In the present report, we propose a laser irradiating controlling method based on monitoring the variation of processing luminance when generating the BVH. Especially, we perform the BVH drilling of high heat radiation PCBs, which becomes to be use for high performance electronic devices, and investigate the influence of laser irradiation condition on the drilled hole quality. As a result, the proposed method is found out to be effective to achieve the high BVH quality in the PCB manufacturing fields. |
| first_indexed | 2024-04-11T08:12:51Z |
| format | Article |
| id | doaj.art-ab9ede7931d84385b003bd1367b23c69 |
| institution | Directory Open Access Journal |
| issn | 2187-9761 |
| language | Japanese |
| last_indexed | 2024-04-11T08:12:51Z |
| publishDate | 2016-03-01 |
| publisher | The Japan Society of Mechanical Engineers |
| record_format | Article |
| series | Nihon Kikai Gakkai ronbunshu |
| spelling | doaj.art-ab9ede7931d84385b003bd1367b23c692022-12-22T04:35:16ZjpnThe Japan Society of Mechanical EngineersNihon Kikai Gakkai ronbunshu2187-97612016-03-018283615-0049115-0049110.1299/transjsme.15-00491transjsmeQuality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed cameraToshiki HIROGAKI0Eiichi AOYAMA1Keiji OGAWA2Suguru ONCHI3Munetaka IOZUMI4Department of Mechanical Engineering, Doshisha UniversityDepartment of Mechanical Engineering, Doshisha UniversityDepartment of Mechanical and Systems Engineering, Ryukoku UniversityGraduate School of Doshisha UniversityGraduate School of Doshisha UniversityRecently, printed circuit boards (PCBs) have become multi-layered and complex. It is to provide both multiple functions and to be compact with the development of electronic device such as smartphones. Processing by CO2 laser is frequently used as an effective method of generating blind via holes (BVHs) to connect the circuit layers of multi-layer board. However, there are some kinds of laser drilling methods in this manufacturing field. Among them, Cu direct laser processing is attracted attention, which is a drilling method of both the surface Cu circuit layer and insulation substrate layer at the same time. In the present report, we propose a laser irradiating controlling method based on monitoring the variation of processing luminance when generating the BVH. Especially, we perform the BVH drilling of high heat radiation PCBs, which becomes to be use for high performance electronic devices, and investigate the influence of laser irradiation condition on the drilled hole quality. As a result, the proposed method is found out to be effective to achieve the high BVH quality in the PCB manufacturing fields.https://www.jstage.jst.go.jp/article/transjsme/82/836/82_15-00491/_pdf/-char/enco2 lasercu-direct drillinghigh-speed cameramulti-layer printed circuitboardprocess controlmonitoring |
| spellingShingle | Toshiki HIROGAKI Eiichi AOYAMA Keiji OGAWA Suguru ONCHI Munetaka IOZUMI Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera Nihon Kikai Gakkai ronbunshu co2 laser cu-direct drilling high-speed camera multi-layer printed circuitboard process control monitoring |
| title | Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera |
| title_full | Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera |
| title_fullStr | Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera |
| title_full_unstemmed | Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera |
| title_short | Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera |
| title_sort | quality control method of blind via hole based on monitoring cu direct laser processing in high heat radiation printed circuit board with a high speed camera |
| topic | co2 laser cu-direct drilling high-speed camera multi-layer printed circuitboard process control monitoring |
| url | https://www.jstage.jst.go.jp/article/transjsme/82/836/82_15-00491/_pdf/-char/en |
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