Deformation patterns and coordination mechanisms of cross-size microchannels during thermocompression bonding process
High-quality bonding of microfluidic chips is essential for driving the rapid marketization of microfluidic devices. While thermocompression bonding is known for its simplicity, challenges such as high deformation and low bond strength persist. In this paper, we conducted micro-scale compression cre...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423019543 |