Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications

The existing von Neumann architecture for artificial intelligence (AI) computations suffers from excessive power consumption and memory bottlenecks. As an alternative, compute-in-memory (CIM) technology has been emerging. Among various CIM device candidates, split-gate NOR flash offers advantages su...

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Main Authors: Chan-Gi Yook, Jung Nam Kim, Yoon Kim, Wonbo Shim
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/14/9/1753
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author Chan-Gi Yook
Jung Nam Kim
Yoon Kim
Wonbo Shim
author_facet Chan-Gi Yook
Jung Nam Kim
Yoon Kim
Wonbo Shim
author_sort Chan-Gi Yook
collection DOAJ
description The existing von Neumann architecture for artificial intelligence (AI) computations suffers from excessive power consumption and memory bottlenecks. As an alternative, compute-in-memory (CIM) technology has been emerging. Among various CIM device candidates, split-gate NOR flash offers advantages such as a high density and low on-state current, enabling low-power operation, and benefiting from a high level of technological maturity. To achieve high energy efficiency and high accuracy in CIM inference chips, it is necessary to optimize device design by targeting low power consumption at the device level and surpassing baseline accuracy at the system level. In split-gate NOR flash, significant factors that can cause CIM inference accuracy drop are the device conductance variation, caused by floating gate charge variation, and a low on-off current ratio. Conductance variation generally has a trade-off relationship with the on-current, which greatly affects CIM dynamic power consumption. In this paper, we propose strategies for designing optimal devices by adjusting oxide thickness and other structural parameters. As a result of setting <i>T<sub>ox,FG</sub></i> to 13.4 nm, <i>T<sub>IPO</sub></i> to 4.6 nm and setting other parameters to optimal points, the design achieves erase on-current below 2 μA, program on-current below 10 pA, and off-current below 1 pA, while maintaining an inference accuracy of over 92%.
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spelling doaj.art-acf3e0071f3243d9a55100d2f0a4914f2023-11-19T12:00:10ZengMDPI AGMicromachines2072-666X2023-09-01149175310.3390/mi14091753Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory ApplicationsChan-Gi Yook0Jung Nam Kim1Yoon Kim2Wonbo Shim3Department of Electrical and Information Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of KoreaSchool of Electrical and Computer Engineering, University of Seoul, Seoul 02504, Republic of KoreaSchool of Electrical and Computer Engineering, University of Seoul, Seoul 02504, Republic of KoreaDepartment of Electrical and Information Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of KoreaThe existing von Neumann architecture for artificial intelligence (AI) computations suffers from excessive power consumption and memory bottlenecks. As an alternative, compute-in-memory (CIM) technology has been emerging. Among various CIM device candidates, split-gate NOR flash offers advantages such as a high density and low on-state current, enabling low-power operation, and benefiting from a high level of technological maturity. To achieve high energy efficiency and high accuracy in CIM inference chips, it is necessary to optimize device design by targeting low power consumption at the device level and surpassing baseline accuracy at the system level. In split-gate NOR flash, significant factors that can cause CIM inference accuracy drop are the device conductance variation, caused by floating gate charge variation, and a low on-off current ratio. Conductance variation generally has a trade-off relationship with the on-current, which greatly affects CIM dynamic power consumption. In this paper, we propose strategies for designing optimal devices by adjusting oxide thickness and other structural parameters. As a result of setting <i>T<sub>ox,FG</sub></i> to 13.4 nm, <i>T<sub>IPO</sub></i> to 4.6 nm and setting other parameters to optimal points, the design achieves erase on-current below 2 μA, program on-current below 10 pA, and off-current below 1 pA, while maintaining an inference accuracy of over 92%.https://www.mdpi.com/2072-666X/14/9/1753compute-in-memory (CIM)NOR flashsplit-gate NOR flashdevice optimizationartificial intelligenceconvolutional neural network
spellingShingle Chan-Gi Yook
Jung Nam Kim
Yoon Kim
Wonbo Shim
Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications
Micromachines
compute-in-memory (CIM)
NOR flash
split-gate NOR flash
device optimization
artificial intelligence
convolutional neural network
title Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications
title_full Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications
title_fullStr Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications
title_full_unstemmed Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications
title_short Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications
title_sort design strategies of 40 nm split gate nor flash memory device for low power compute in memory applications
topic compute-in-memory (CIM)
NOR flash
split-gate NOR flash
device optimization
artificial intelligence
convolutional neural network
url https://www.mdpi.com/2072-666X/14/9/1753
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