Effect of Thermal Aging on the Mechanical Properties of SAC305
Many electronic products are subjected to heat for long periods, depending on their operations. Thus, it is expected that the physical and mechanical properties of electronic elements, including the soldering joints, will be affected. In this study, the impact of thermal aging time and temperature o...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-04-01
|
| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/15/8/2816 |