Thermal Analysis of FIMS TDC and LVPS Electronic Boards

Thermal Analysis of FIMS TDC and LVPS Electronic Boards

Electronic boards of Far-ultraviolet IMaging Spectrograph (FIMS) should be designed to maintain their performances, and their temperatures should be remained within the allowed temperatures in operational environments. Thermal analysis at the electronic board level has been performed, and it is conf...

Full description

Bibliographic Details
Main Authors: K.-I. Seon, I.-S. Yuk, U.-W. Nam, H. Jin, J.-H. Park, J.-G. Rhee, K.-S. Ryu, D.-H. Lee, H.-S. Oh, K.-K. Kong, W. Han, K.-W. Min, J. Edelstein, E. Korpela
Format: Article
Language:English
Published: The Korean Space Science Society 2002-12-01
Series:Journal of Astronomy and Space Sciences
Subjects:
finite-elements methods
electronic boards
heat transfer
Online Access:http://ocean.kisti.re.kr/downfile/volume/kosss/OJOOBS/2002/v19n4/OJOOBS_2002_v19n4_283.pdf

Internet

http://ocean.kisti.re.kr/downfile/volume/kosss/OJOOBS/2002/v19n4/OJOOBS_2002_v19n4_283.pdf

Similar Items