Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study

Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study

The implementation of environment friendly technologies in microelectronic packaging industry has widened the essentialities of lead-free solder alloys. The Cu3Sn intermetallic compound is blameworthy for the adverse influences of the mechanical and thermal properties of the lead-free solder alloys....

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Bibliographic Details
Main Authors: Md. Maruf Billah, Abdur Rahman Aad, Shimanta Das, Mohammad Motalab, Ratul Paul
Format: Article
Language:English
Published: Elsevier 2023-03-01
Series:Alexandria Engineering Journal
Subjects:
Intermetallic Compounds
SAC Solder
Anisotropic Cu3Sn
Mechanical Properties
CTE
Online Access:http://www.sciencedirect.com/science/article/pii/S1110016822007578

Internet

http://www.sciencedirect.com/science/article/pii/S1110016822007578

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