Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Diamond has the highest thermal conductivity among naturally occurring materials and a relatively low coefficient of thermal expansion (CTE), making it a promising interconnected material for next-generation semiconductor power devices. In this study, Ag/diamond composite sintering paste was develop...

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Bibliographic Details
Main Authors: Yuxin Xu, Xiaoming Qiu, Wangyun Li, Suyu Wang, Ninshu Ma, Minoru Ueshima, Chuantong Chen, Katsuaki Suganuma
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:Journal of Materials Research and Technology
Subjects:
Ag/diamond composite paste
SiC power modules
Thermal shock test
Microstructure evolution
Fracture behavior
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423017830

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http://www.sciencedirect.com/science/article/pii/S2238785423017830

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