Signal Integrity Analysis of RF Probe Card for WLCSP Testing Using Polyimide-Based Grounded Coplanar Waveguide Transmission Lines
Wafer-level chip-scale packages have been extensively adopted in the electronic packaging industry owing to their ability to enhance device performance. This study proposes a novel radio frequency probe card designed for wafer-level chip-scale package testing for frequency of up to 8 GHz, employing...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10195940/ |