Polymer‐based nanocomposites in semiconductor packaging

Abstract Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, p...

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Bibliographic Details
Main Authors: Tengyu Li, Peng Li, Rong Sun, Shuhui Yu
Format: Article
Language:English
Published: Wiley 2023-09-01
Series:IET Nanodielectrics
Subjects:
Online Access:https://doi.org/10.1049/nde2.12050