On-Machine Detection of Sub-Microscale Defects in Diamond Tool Grinding during the Manufacturing Process Based on DToolnet
Nowadays, tool condition monitoring (TCM), which can prevent the waste of resources and improve efficiency in the process of machining parts, has developed many mature methods. However, TCM during the production of cutting tools is less studied and has different properties. The scale of the defects...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-03-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/22/7/2426 |