Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications

Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications

Embedded-chip planar silver-elastomer interconnect technology is developed with flexible substrates and demonstrated for on-skin biophotonic sensor applications. This approach has several benefits and is also consistent with chip-thinning where the chip thickness is 100 microns and less. The key ben...

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Bibliographic Details
Main Authors: Akeeb Hassan, Sepehr Soroushiani, Abdulhameed Abdal, Sk Yeahia Been Sayeed, Wei-Chiang Lin, Markondeya Raj Pulugurtha
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Open Journal of Nanotechnology
Subjects:
Fan-out
die-embedding
deformable
flexible
interconnects
biophotonics
Online Access:https://ieeexplore.ieee.org/document/9745373/

Internet

https://ieeexplore.ieee.org/document/9745373/

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