Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications
In advanced packaging schemes, such as fan-out integration technology, photosensitive polyimide (PSPI) is the key material to the fabrication of panel level redistribution-layer (RDL). However, a large mismatch of coefficient of thermal expansion (CTE) between silicon (Si) and PSPI will cause seriou...
| প্রধান লেখক: | , , , , |
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| বিন্যাস: | প্রবন্ধ |
| ভাষা: | English |
| প্রকাশিত: |
IEEE
2024-01-01
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| মালা: | IEEE Journal of the Electron Devices Society |
| বিষয়গুলি: | |
| অনলাইন ব্যবহার করুন: | https://ieeexplore.ieee.org/document/10415013/ |