The Effect of the Cooling Rate on the Microstructure and Microsegregation: An Experimental and Numerical Investigation of Solidification in Hypoperitectic Cu − 20 wt.% Sn Alloy

The Effect of the Cooling Rate on the Microstructure and Microsegregation: An Experimental and Numerical Investigation of Solidification in Hypoperitectic Cu − 20 wt.% Sn Alloy

Abstract Hypoperitectic Cu − 20 wt.% Sn alloy was solidified under different cooling rates and solidification growths using directional solidification system. The effects of cooling rate and solidification growth on the microsegregation profiles and tertiary dendritic arm spacing (λ3) were experimen...

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Bibliographic Details
Main Authors: Késsia Gomes Paradela, Wysllan Jefferson Lima Garção, Luis Antônio de Souza Baptista, Roberto Carlos Sales, Vânia Cristina de Oliveira, Alexandre Furtado Ferreira
Format: Article
Language:English
Published: Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) 2020-08-01
Series:Materials Research
Subjects:
Cu-Sn alloy
solidification
dendritic microstructure
microsegregation
phase-field model
Online Access:http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000400207&tlng=en

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http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000400207&tlng=en

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