Study of robust package strength characterization of memory packages for handheld application

Study of robust package strength characterization of memory packages for handheld application

In mobile market, the demand of memory packaging increase year over year. While the form factor of memory packages moves toward smaller and thinner geometry with higher pin counts, the package overall mechanical robustness becomes one of a key criteria for mobile companies regarding to consumer usag...

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Bibliographic Details
Main Authors: Vance Liu, Chien-Ming Chen, Joyce Chen, Min-Hua Chung, Chong Leong Gan
Format: Article
Language:English
Published: Elsevier 2022-12-01
Series:Memories - Materials, Devices, Circuits and Systems
Subjects:
Package strength
Three-point bending
Drop impact test
Memory electronic packages
Mobile application
Probabilistic mechanics
Online Access:http://www.sciencedirect.com/science/article/pii/S2773064622000123

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http://www.sciencedirect.com/science/article/pii/S2773064622000123

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