Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 μm) onto copper patterns/polyimide (PI) film to produce the structure of coverlay/Cu patt...

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Bibliographic Details
Main Authors: Jeongah Kim, Bo-Young Kim, Seong Dae Park, Ji-Hun Seo, Chan-Jae Lee, Myong Jae Yoo, Youngmin Kim
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Micromachines
Subjects:
flexible printed circuit boards
coverlay
poly(amide-imide-urethane)
interpenetrating network
MIT folding test
Online Access:https://www.mdpi.com/2072-666X/12/8/943

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https://www.mdpi.com/2072-666X/12/8/943

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