Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte
A hydrometallurgical process applicable to printed circuit boards of small electrical and electronic devices was developed. This involved three leaching steps (60 ºC, 2 h): 6 mol L-1 NaOH, 6 mol L-1 HCl and aqua regia. NaOH removed the resin and flame retardant that covered the circuit boards. HCl d...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Sociedade Brasileira de Química
2013-01-01
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| Series: | Química Nova |
| Subjects: | |
| Online Access: | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0100-40422013000400015&lng=en&tlng=en |