Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology
In the era of big data, the advantages of 3D packaging are becoming increasingly significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of the PCB and BGA components leads to dynamic warpage of the system, and the expansion and innovation of low-temperature solderi...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423009298 |