Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology
In the era of big data, the advantages of 3D packaging are becoming increasingly significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of the PCB and BGA components leads to dynamic warpage of the system, and the expansion and innovation of low-temperature solderi...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423009298 |
| _version_ | 1827920229681856512 |
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| author | Xuefeng Wu Lingyao Sun Yingxia Liu Ziting Ye Xiuchen Zhao Ying Liu |
| author_facet | Xuefeng Wu Lingyao Sun Yingxia Liu Ziting Ye Xiuchen Zhao Ying Liu |
| author_sort | Xuefeng Wu |
| collection | DOAJ |
| description | In the era of big data, the advantages of 3D packaging are becoming increasingly significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of the PCB and BGA components leads to dynamic warpage of the system, and the expansion and innovation of low-temperature soldering have been a new trend. We developed a fully mixed solder joint of a SAC305(Sn-3.0Ag-0.5Cu wt.%) solder ball and Sn–58Bi(wt.%) solder paste by solid-liquid low-temperature solder bonding technology. The mixing degree and diffusion process of the two were calculated and simulated by mathematical calculation and COMSOL Multiphysics. The results show that a completely mixed solder joint can be obtained after reflow at 210 °C for 5 min. The average shear strength of the composite solder joints was 63.68 ± 1.12 MPa, which was about twice that of the single SAC305 and Sn58Bi solder joints, and the shear fracture was a composite mode of brittle and ductile fracture, which appeared in the IMC and the solder, respectively. After complete mixing, the solder wettability angle was less than 26.68°, with outstanding wetting properties. No phase transition occurred after aging, the distribution of each phase remained uniform, and no enrichment of the brittle phase was observed at the interface. The shear strength decreased slightly with aging time, and the reduction value was less than 10 MPa, which has good reliability. |
| first_indexed | 2024-03-13T04:09:41Z |
| format | Article |
| id | doaj.art-b4776b8b73de4844873f24f61db45e5d |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-13T04:09:41Z |
| publishDate | 2023-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-b4776b8b73de4844873f24f61db45e5d2023-06-21T06:57:15ZengElsevierJournal of Materials Research and Technology2238-78542023-05-012463786390Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technologyXuefeng Wu0Lingyao Sun1Yingxia Liu2Ziting Ye3Xiuchen Zhao4Ying Liu5Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaBeijing Institute of Computer Technology and Applications, Beijing 100854, ChinaDepartment of Advanced Design and System Engineering, City University of Hong Kong, HongKong SARDepartment of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaDepartment of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China; Corresponding author. Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaDepartment of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaIn the era of big data, the advantages of 3D packaging are becoming increasingly significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of the PCB and BGA components leads to dynamic warpage of the system, and the expansion and innovation of low-temperature soldering have been a new trend. We developed a fully mixed solder joint of a SAC305(Sn-3.0Ag-0.5Cu wt.%) solder ball and Sn–58Bi(wt.%) solder paste by solid-liquid low-temperature solder bonding technology. The mixing degree and diffusion process of the two were calculated and simulated by mathematical calculation and COMSOL Multiphysics. The results show that a completely mixed solder joint can be obtained after reflow at 210 °C for 5 min. The average shear strength of the composite solder joints was 63.68 ± 1.12 MPa, which was about twice that of the single SAC305 and Sn58Bi solder joints, and the shear fracture was a composite mode of brittle and ductile fracture, which appeared in the IMC and the solder, respectively. After complete mixing, the solder wettability angle was less than 26.68°, with outstanding wetting properties. No phase transition occurred after aging, the distribution of each phase remained uniform, and no enrichment of the brittle phase was observed at the interface. The shear strength decreased slightly with aging time, and the reduction value was less than 10 MPa, which has good reliability.http://www.sciencedirect.com/science/article/pii/S2238785423009298Solid-liquid low-temperature solderingMixed solder jointsShearing strengthAdvanced packaging |
| spellingShingle | Xuefeng Wu Lingyao Sun Yingxia Liu Ziting Ye Xiuchen Zhao Ying Liu Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology Journal of Materials Research and Technology Solid-liquid low-temperature soldering Mixed solder joints Shearing strength Advanced packaging |
| title | Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology |
| title_full | Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology |
| title_fullStr | Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology |
| title_full_unstemmed | Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology |
| title_short | Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology |
| title_sort | preparation and performance of sn based composite solder joints by solid liquid low temperature solder bonding technology |
| topic | Solid-liquid low-temperature soldering Mixed solder joints Shearing strength Advanced packaging |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423009298 |
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