An Analytical Method for Modelling Pull-In Effect during Anodic Bonding
Pull-in effect is a common phenomenon during anodic bonding, a key step in the<br />fabrication processes of capacitive sensors and actuators. To assist the designs and fabrications of<br />these transducers, this paper presents an analytical method for modelling the pull-in effect durin...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-12-01
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| Series: | Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-3900/2/13/969 |