An Analytical Method for Modelling Pull-In Effect during Anodic Bonding
Pull-in effect is a common phenomenon during anodic bonding, a key step in the<br />fabrication processes of capacitive sensors and actuators. To assist the designs and fabrications of<br />these transducers, this paper presents an analytical method for modelling the pull-in effect durin...
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| Format: | Article |
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MDPI AG
2018-12-01
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| Series: | Proceedings |
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| Online Access: | https://www.mdpi.com/2504-3900/2/13/969 |
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| author | Qiuxu Wei Bo Xie Yulan Lu Deyong Chen Jian Chen Junbo Wang |
| author_facet | Qiuxu Wei Bo Xie Yulan Lu Deyong Chen Jian Chen Junbo Wang |
| author_sort | Qiuxu Wei |
| collection | DOAJ |
| description | Pull-in effect is a common phenomenon during anodic bonding, a key step in the<br />fabrication processes of capacitive sensors and actuators. To assist the designs and fabrications of<br />these transducers, this paper presents an analytical method for modelling the pull-in effect during<br />anodic bonding. The pull-in effect model was verified by finite element analysis and a verification<br />experiment respectively. The verification results indicate that the analytical method for modelling<br />the pull-in effect during anodic bonding is capable for predicting pull-in voltages of anodically<br />bonded capacitive sensors and actuators in a universal and practical manner without any additional<br />fabrication process. |
| first_indexed | 2024-04-13T01:02:25Z |
| format | Article |
| id | doaj.art-b5d02af5977b474eb5a93c148182949c |
| institution | Directory Open Access Journal |
| issn | 2504-3900 |
| language | English |
| last_indexed | 2025-03-20T06:18:31Z |
| publishDate | 2018-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Proceedings |
| spelling | doaj.art-b5d02af5977b474eb5a93c148182949c2024-10-02T16:08:57ZengMDPI AGProceedings2504-39002018-12-0121396910.3390/proceedings2130969proceedings2130969An Analytical Method for Modelling Pull-In Effect during Anodic BondingQiuxu Wei0Bo Xie1Yulan Lu2Deyong Chen3Jian Chen4Junbo Wang5Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Electronics, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Electronics, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Electronics, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Electronics, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Electronics, Chinese Academy of Sciences, Beijing 100190, ChinaPull-in effect is a common phenomenon during anodic bonding, a key step in the<br />fabrication processes of capacitive sensors and actuators. To assist the designs and fabrications of<br />these transducers, this paper presents an analytical method for modelling the pull-in effect during<br />anodic bonding. The pull-in effect model was verified by finite element analysis and a verification<br />experiment respectively. The verification results indicate that the analytical method for modelling<br />the pull-in effect during anodic bonding is capable for predicting pull-in voltages of anodically<br />bonded capacitive sensors and actuators in a universal and practical manner without any additional<br />fabrication process.https://www.mdpi.com/2504-3900/2/13/969pull-in effectanodic bondingcapacitive transducer |
| spellingShingle | Qiuxu Wei Bo Xie Yulan Lu Deyong Chen Jian Chen Junbo Wang An Analytical Method for Modelling Pull-In Effect during Anodic Bonding Proceedings pull-in effect anodic bonding capacitive transducer |
| title | An Analytical Method for Modelling Pull-In Effect during Anodic Bonding |
| title_full | An Analytical Method for Modelling Pull-In Effect during Anodic Bonding |
| title_fullStr | An Analytical Method for Modelling Pull-In Effect during Anodic Bonding |
| title_full_unstemmed | An Analytical Method for Modelling Pull-In Effect during Anodic Bonding |
| title_short | An Analytical Method for Modelling Pull-In Effect during Anodic Bonding |
| title_sort | analytical method for modelling pull in effect during anodic bonding |
| topic | pull-in effect anodic bonding capacitive transducer |
| url | https://www.mdpi.com/2504-3900/2/13/969 |
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