An Analytical Method for Modelling Pull-In Effect during Anodic Bonding

An Analytical Method for Modelling Pull-In Effect during Anodic Bonding

Pull-in effect is a common phenomenon during anodic bonding, a key step in the<br />fabrication processes of capacitive sensors and actuators. To assist the designs and fabrications of<br />these transducers, this paper presents an analytical method for modelling the pull-in effect durin...

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Bibliographic Details
Main Authors:	Qiuxu Wei, Bo Xie, Yulan Lu, Deyong Chen, Jian Chen, Junbo Wang
Format:	Article
Language:	English
Published:	MDPI AG 2018-12-01
Series:	Proceedings
Subjects:	pull-in effect anodic bonding capacitive transducer
Online Access:	https://www.mdpi.com/2504-3900/2/13/969

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