Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

Cu–9Ni–6Sn alloys have received widespread attention due to their good mechanical properties and resistance to stress relaxation in the electronic and electrical industries. The hot compression deformation behaviors of the Cu–9Ni–6Sn–0.3Mn–0.2Zn alloy were investigated using the Gleeble-3500 thermal...

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Bibliographic Details
Main Authors: Yufang Zhang, Zhu Xiao, Xiangpeng Meng, Lairong Xiao, Yongjun Pei, Xueping Gan
Format: Article
Language:English
Published: MDPI AG 2023-02-01
Series:Materials
Subjects:
Cu–9Ni–6Sn
hot deformation
processing map
microstucture
finite element analysis
Online Access:https://www.mdpi.com/1996-1944/16/4/1445

Internet

https://www.mdpi.com/1996-1944/16/4/1445

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