Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties
The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental...
Main Authors: | , , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
The Netherlands Press
2017-09-01
|
Series: | Metallurgical & Materials Engineering |
Subjects: | |
Online Access: | https://metall-mater-eng.com/index.php/home/article/view/316 |