Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties
The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
The Netherlands Press
2017-09-01
|
| Series: | Metallurgical & Materials Engineering |
| Subjects: | |
| Online Access: | https://metall-mater-eng.com/index.php/home/article/view/316 |
| Summary: | The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3. |
|---|---|
| ISSN: | 2217-8961 |