Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers
Epoxy resin is widely used due to its electrical insulation performances, but low elongation defects at the break, low thermal conductivity, and high brittleness limit its application scenarios. In this paper, the mesogen is utilized to improve the thermal conductivity and mechanical toughness of th...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9351965/ |