Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers
Epoxy resin is widely used due to its electrical insulation performances, but low elongation defects at the break, low thermal conductivity, and high brittleness limit its application scenarios. In this paper, the mesogen is utilized to improve the thermal conductivity and mechanical toughness of th...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2021-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/9351965/ |
| _version_ | 1818727572239810560 |
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| author | Kaiyi Tian Senyuan Yang Jiaxuan Niu Hanxiang Wang |
| author_facet | Kaiyi Tian Senyuan Yang Jiaxuan Niu Hanxiang Wang |
| author_sort | Kaiyi Tian |
| collection | DOAJ |
| description | Epoxy resin is widely used due to its electrical insulation performances, but low elongation defects at the break, low thermal conductivity, and high brittleness limit its application scenarios. In this paper, the mesogen is utilized to improve the thermal conductivity and mechanical toughness of the traditional epoxy resin. Both the mechanical performances, including the impact strength, tensile strength, the bending strength, and the thermal behaviors, including the thermal conductivity, are investigated. Results show that with the biphenyl liquid crystal epoxy resin(BLCER) content of 10%, the impacting strength, tensile strength, and bending strength are increased by 71%, 21%, and 11%, respectively. The thermal conductivity of the composites increases to 2.26 times that of pure epoxy resin. Both the enhanced mechanical and thermal performance of the epoxy resin by the mesogen incorporation are further investigated. It is indicated that the mesogen in the Biphenyl Liquid Crystal Epoxy Resin significantly improve both the mechanical toughness and thermal conductivity of the epoxy resin by the formation of the micro-crack behavior and the thermal conductive networks, respectively. With the aids of the mesogen, the improved variety of properties in epoxy resin without reducing its original performance is attractive in the industry application with great demand in the balance of the comprehensive performances. |
| first_indexed | 2024-12-17T22:16:14Z |
| format | Article |
| id | doaj.art-b70707776623423e855f125dbed35c1c |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-12-17T22:16:14Z |
| publishDate | 2021-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-b70707776623423e855f125dbed35c1c2022-12-21T21:30:36ZengIEEEIEEE Access2169-35362021-01-019315753158010.1109/ACCESS.2021.30586129351965Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without NanofillersKaiyi Tian0https://orcid.org/0000-0002-9815-5961Senyuan Yang1Jiaxuan Niu2Hanxiang Wang3State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, ChinaState Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, ChinaState Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, ChinaState Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, ChinaEpoxy resin is widely used due to its electrical insulation performances, but low elongation defects at the break, low thermal conductivity, and high brittleness limit its application scenarios. In this paper, the mesogen is utilized to improve the thermal conductivity and mechanical toughness of the traditional epoxy resin. Both the mechanical performances, including the impact strength, tensile strength, the bending strength, and the thermal behaviors, including the thermal conductivity, are investigated. Results show that with the biphenyl liquid crystal epoxy resin(BLCER) content of 10%, the impacting strength, tensile strength, and bending strength are increased by 71%, 21%, and 11%, respectively. The thermal conductivity of the composites increases to 2.26 times that of pure epoxy resin. Both the enhanced mechanical and thermal performance of the epoxy resin by the mesogen incorporation are further investigated. It is indicated that the mesogen in the Biphenyl Liquid Crystal Epoxy Resin significantly improve both the mechanical toughness and thermal conductivity of the epoxy resin by the formation of the micro-crack behavior and the thermal conductive networks, respectively. With the aids of the mesogen, the improved variety of properties in epoxy resin without reducing its original performance is attractive in the industry application with great demand in the balance of the comprehensive performances.https://ieeexplore.ieee.org/document/9351965/Mesogenepoxy resintoughnessthermal conductivity |
| spellingShingle | Kaiyi Tian Senyuan Yang Jiaxuan Niu Hanxiang Wang Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers IEEE Access Mesogen epoxy resin toughness thermal conductivity |
| title | Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers |
| title_full | Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers |
| title_fullStr | Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers |
| title_full_unstemmed | Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers |
| title_short | Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers |
| title_sort | enhanced thermal conductivity and mechanical toughness of the epoxy resin by incorporation of mesogens without nanofillers |
| topic | Mesogen epoxy resin toughness thermal conductivity |
| url | https://ieeexplore.ieee.org/document/9351965/ |
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