Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Rapid and precise reliability evaluation of electronic circuits plays a key role in the design stage of the electronic systems. The task becomes even more difficult when several major parameters contribute into the reliability evaluation. This paper proposes a neural network aided approach as a pred...

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Bibliographic Details
Main Authors: Reza Reihanisaransari, Farshad Samadifam, Anas A. Salameh, Farzam Mohammadiazar, Nafiseh Amiri, Sittiporn Channumsin
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Access
Subjects:
Solder joint
drop test
lifetime estimation
machine learning
Online Access:https://ieeexplore.ieee.org/document/9957000/

Internet

https://ieeexplore.ieee.org/document/9957000/

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