Highly thermally conductive composite films by the rational assembly of aramid nanofibers with low-dimensional nanofillers
Highly efficient thermal management of electronic devices has grown in significance with the burgeoning of semiconductor technology and 5th generation communication. It is urgently desired to rationally construct highly thermally conductive composite films for enhancing the performance, service life...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542400869X |