Research of Vertical via Based on Silicon, Ceramic and Glass

With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Mo...

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Main Authors: Wenchao Tian, Sixian Wu, Wenhua Li
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/14/7/1391
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author Wenchao Tian
Sixian Wu
Wenhua Li
author_facet Wenchao Tian
Sixian Wu
Wenhua Li
author_sort Wenchao Tian
collection DOAJ
description With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Moore’s Law because of its advantages of low energy consumption, lightweight and high performance. Through-silicon via (TSV) is considered to be at the core of 3D integration because of its excellent electrical performance, lower power consumption, wider bandwidth, higher density, smaller overall size and lighter weight. Therefore, the particular emphasis of this review is the process flow of TSV technology. Among them, the research status of TSV hole etching, deep hole electroplating filling and chemical mechanical planarization (CMP) in TSV preparation process are introduced in detail. There are a multitude of inevitable defects in the process of TSV processing; thus, the stress problems and electrical characteristics that affect the reliability of TSV are summarized in this review. In addition, the process flow and process optimization status of through ceramic via (TCV) and through glass via (TGV) are discussed.
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spelling doaj.art-b851d14b342a4fb6b75b0e17fff71c6f2023-11-18T20:32:46ZengMDPI AGMicromachines2072-666X2023-07-01147139110.3390/mi14071391Research of Vertical via Based on Silicon, Ceramic and GlassWenchao Tian0Sixian Wu1Wenhua Li2School of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, ChinaSchool of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, ChinaSchool of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, ChinaWith the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Moore’s Law because of its advantages of low energy consumption, lightweight and high performance. Through-silicon via (TSV) is considered to be at the core of 3D integration because of its excellent electrical performance, lower power consumption, wider bandwidth, higher density, smaller overall size and lighter weight. Therefore, the particular emphasis of this review is the process flow of TSV technology. Among them, the research status of TSV hole etching, deep hole electroplating filling and chemical mechanical planarization (CMP) in TSV preparation process are introduced in detail. There are a multitude of inevitable defects in the process of TSV processing; thus, the stress problems and electrical characteristics that affect the reliability of TSV are summarized in this review. In addition, the process flow and process optimization status of through ceramic via (TCV) and through glass via (TGV) are discussed.https://www.mdpi.com/2072-666X/14/7/1391TSVTGVTCVprocess optimization
spellingShingle Wenchao Tian
Sixian Wu
Wenhua Li
Research of Vertical via Based on Silicon, Ceramic and Glass
Micromachines
TSV
TGV
TCV
process optimization
title Research of Vertical via Based on Silicon, Ceramic and Glass
title_full Research of Vertical via Based on Silicon, Ceramic and Glass
title_fullStr Research of Vertical via Based on Silicon, Ceramic and Glass
title_full_unstemmed Research of Vertical via Based on Silicon, Ceramic and Glass
title_short Research of Vertical via Based on Silicon, Ceramic and Glass
title_sort research of vertical via based on silicon ceramic and glass
topic TSV
TGV
TCV
process optimization
url https://www.mdpi.com/2072-666X/14/7/1391
work_keys_str_mv AT wenchaotian researchofverticalviabasedonsiliconceramicandglass
AT sixianwu researchofverticalviabasedonsiliconceramicandglass
AT wenhuali researchofverticalviabasedonsiliconceramicandglass