Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

The increasing miniaturization of functional devices drives the microelectronic industry to pursuit large-span-ratio and high-density wire bonding packaging technology as it can facilely interconnect various chips at a low cost. The design method of wire bonder head trace is urgently needed in the P...

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Bibliographic Details
Main Authors: Yun Chen, Shuquan Ding, Junyu Long, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, Ching-Ping Wong
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
High-density wire bonding
designing wire bonder head trace
large span ratio looping
advanced packaging
explicit finite element analysis
Online Access:https://ieeexplore.ieee.org/document/9256258/

Internet

https://ieeexplore.ieee.org/document/9256258/

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