Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging
The increasing miniaturization of functional devices drives the microelectronic industry to pursuit large-span-ratio and high-density wire bonding packaging technology as it can facilely interconnect various chips at a low cost. The design method of wire bonder head trace is urgently needed in the P...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2020-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/9256258/ |
| _version_ | 1819172960765739008 |
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| author | Yun Chen Shuquan Ding Junyu Long Maoxiang Hou Xin Chen Jian Gao Yunbo He Ching-Ping Wong |
| author_facet | Yun Chen Shuquan Ding Junyu Long Maoxiang Hou Xin Chen Jian Gao Yunbo He Ching-Ping Wong |
| author_sort | Yun Chen |
| collection | DOAJ |
| description | The increasing miniaturization of functional devices drives the microelectronic industry to pursuit large-span-ratio and high-density wire bonding packaging technology as it can facilely interconnect various chips at a low cost. The design method of wire bonder head trace is urgently needed in the Post Moore Era. Herein, a rational design strategy of wire bonder head trace was proposed. By solving the geometric mapping equations derived from the geometrical evolution of the wire loop, the wire bonder head trace can be easily designed to fit the desired loop profile. The explicit finite element model was also developed to verify the designed wire bonder head trace and disclose the dynamic evolution of strain/stress on wire loops simultaneously. Furthermore, by using orthogonal experimental design, the trace height was found to be the most critical geometric factor influencing loop profiles. The proposed strategy was illustrated to design wire bonder head traces with which large span-ratio loops (>5) with the finest reported gold wire (sub-10 μm) were successfully formed. The mechanical strength tests showed the wire loops were superior to loops with other larger wire. The proposed strategy significantly improves the efficiency of design reliable wire bonder head trace for high-density packaging and will have broad application prospects in microelectronic industry. |
| first_indexed | 2024-12-22T20:15:29Z |
| format | Article |
| id | doaj.art-b856b30ad9b045d483ce737de4bfc240 |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-12-22T20:15:29Z |
| publishDate | 2020-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-b856b30ad9b045d483ce737de4bfc2402022-12-21T18:13:58ZengIEEEIEEE Access2169-35362020-01-01820657120658010.1109/ACCESS.2020.30373389256258Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked PackagingYun Chen0https://orcid.org/0000-0002-4988-8894Shuquan Ding1https://orcid.org/0000-0001-5512-9790Junyu Long2Maoxiang Hou3Xin Chen4Jian Gao5https://orcid.org/0000-0001-5625-7751Yunbo He6https://orcid.org/0000-0002-6933-1209Ching-Ping Wong7https://orcid.org/0000-0003-3556-8053State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, ChinaSchool of Engineering, The Chinese University of Hong Kong, Hong KongThe increasing miniaturization of functional devices drives the microelectronic industry to pursuit large-span-ratio and high-density wire bonding packaging technology as it can facilely interconnect various chips at a low cost. The design method of wire bonder head trace is urgently needed in the Post Moore Era. Herein, a rational design strategy of wire bonder head trace was proposed. By solving the geometric mapping equations derived from the geometrical evolution of the wire loop, the wire bonder head trace can be easily designed to fit the desired loop profile. The explicit finite element model was also developed to verify the designed wire bonder head trace and disclose the dynamic evolution of strain/stress on wire loops simultaneously. Furthermore, by using orthogonal experimental design, the trace height was found to be the most critical geometric factor influencing loop profiles. The proposed strategy was illustrated to design wire bonder head traces with which large span-ratio loops (>5) with the finest reported gold wire (sub-10 μm) were successfully formed. The mechanical strength tests showed the wire loops were superior to loops with other larger wire. The proposed strategy significantly improves the efficiency of design reliable wire bonder head trace for high-density packaging and will have broad application prospects in microelectronic industry.https://ieeexplore.ieee.org/document/9256258/High-density wire bondingdesigning wire bonder head tracelarge span ratio loopingadvanced packagingexplicit finite element analysis |
| spellingShingle | Yun Chen Shuquan Ding Junyu Long Maoxiang Hou Xin Chen Jian Gao Yunbo He Ching-Ping Wong Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging IEEE Access High-density wire bonding designing wire bonder head trace large span ratio looping advanced packaging explicit finite element analysis |
| title | Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging |
| title_full | Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging |
| title_fullStr | Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging |
| title_full_unstemmed | Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging |
| title_short | Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging |
| title_sort | rationally designing the trace of wire bonder head for large span ratio wire bonding in 3d stacked packaging |
| topic | High-density wire bonding designing wire bonder head trace large span ratio looping advanced packaging explicit finite element analysis |
| url | https://ieeexplore.ieee.org/document/9256258/ |
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