Mechanical Stress Analysis in High Power Press Pack IGBT
Mechanical stress is one of the key factors affecting the electrical characteristics, thermal characteristics and reliability of high-voltage high-power press-pack IGBT devices. First of all, in this paper, from the perspective of chip and package structure design, the research status and key design...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
State Grid Energy Research Institute
2020-12-01
|
| Series: | Zhongguo dianli |
| Subjects: | |
| Online Access: | https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.202005029 |