Online Recognition of Fallen-Off Bond Wires in IGBT Modules

As a core component of power conversion systems, insulated gate bipolar transistor (IGBT) modules continually suffer from severe thermal damage caused by temperature swings and shear stress, resulting in fatigue failure. Bond wires falling off is one of the failure modes of IGBT modules. Given that...

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Bibliographic Details
Main Authors: Zhen Hu, Man Cui, Tao Shi
Format: Article
Language:English
Published: MDPI AG 2024-03-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/15/3/404