Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout
The thermal effect and heat dissipation have a significant impact on three-dimensional stacked chips, and the positional layout of the chip’s three-dimensional layout directly affects the internal temperature field. One effective way is to plan the overall layout of three-dimensional integrated circ...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-09-01
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| Series: | Technologies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2227-7080/11/5/122 |