A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy
For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. However, Pb is very toxic and Pb us...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2023-09-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | https://journals.pan.pl/Content/128402/PDF/AMM-2023-3-18-Mohd%20Salleh.pdf |