Study on the mechanism of forming silver nanoparticles on micron-scale flake silver powder
Due to the high conductivity and stability of silver, silver ink has been widely used in the field of printed electronics. However, since mechanical strain would cause the contact between key particles to be broken. Recently, higher requirements have been put on the bending resistance of silver past...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/abbafa |