The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

The surface finish (SF) becomes a part of the solder joint during assembly and improves the component’s reliability. Furthermore, the SF influences the solder joint’s reliability by affecting the thickness of the intermetallic compound (IMC) layer at the solder interface and copper pads. In this exp...

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Bibliographic Details
Main Authors: Francy John Akkara, Sa’d Hamasha, Ali Alahmer, John Evans, Mohamed El Amine Belhadi, Xin Wei
Format: Article
Language:English
Published: MDPI AG 2022-09-01
Series:Materials
Subjects:
surface finishes
micro-alloy
ENIG
microstructure
SAC
reliability
Online Access:https://www.mdpi.com/1996-1944/15/19/6759

Internet

https://www.mdpi.com/1996-1944/15/19/6759

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