Retesting Schemes That Improve Test Quality and Yield Using a Test Guardband
The digital integrated circuit (IC) testing model module is applied in this study to simulate the fabrication and testing of integrated circuits. The yield and quality of ICs are analyzed by assuming that the wafer devices under test conditions are normal probability distributions. The difficulties...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-12-01
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| Series: | Eng |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4117/4/4/169 |