Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks

Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks

This study introduces an enhanced thermal management strategy for efficient heat dissipation from GaN power amplifiers with high power densities. The advantages of applying an advanced liquid-looped silicon-based micro-pin fin heat sink (MPFHS) as the mounting plate for GaN devices are illustrated u...

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Bibliographic Details
Main Authors: Ting Kang, Yuxin Ye, Yuncong Jia, Yanmei Kong, Binbin Jiao
Format: Article
Language:English
Published: MDPI AG 2020-10-01
Series:Electronics
Subjects:
GaN-on-SiC
micro-pin fin heat sink
thermal management
thermal resistance
Online Access:https://www.mdpi.com/2079-9292/9/11/1778

Internet

https://www.mdpi.com/2079-9292/9/11/1778

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